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EUV high resolution imager on-board Solar Orbiter: optical design and detector performances.

机译:EUV高分辨率成像仪车载太阳轨道器:光学设计和探测器性能。

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摘要

The EUV high resolution imager (HRI) channel of the Extreme Ultraviolet Imager (EUI) on-board Solar Orbiter will observe the solar atmospheric layers at 17.4 nm wavelength with a 200 km resolution. The HRI channel is based on a compact two mirrors off-axis design. The spectral selection is obtained by a multilayer coating deposited on the mirrors and by redundant Aluminum filters rejecting the visible and infrared light. The detector is a 2k x 2k array back-thinned silicon CMOS-APS with 10 µm pixel pitch, sensitive in the EUV wavelength range.Due to the instrument compactness and the constraints on the optical design, the channel performance is very sensitive to the manufacturing, alignments and settling errors. A trade-off between two optical layouts was therefore performed to select the final optical design and to improve the mirror mounts. The effect of diffraction by the filter mesh support and by the mirror diffusion has been included in the overall error budget. Manufacturing of mirror and mounts has started and will result in thermo-mechanical validation on the EUI instrument structural and thermal model (STM).Because of the limited channel entrance aperture and consequently the low input flux, the channel performance also relies on the detector EUV sensitivity, readout noise and dynamic range. Based on the characterization of a CMOS-APS back-side detector prototype, showing promising results, the EUI detector has been specified and is under development. These detectors will undergo a qualification program before being tested and integrated on the EUI instrument.
机译:车载极紫外成像仪(EUI)的EUV高分辨率成像仪(HRI)通道将以200 km的分辨率观察17.4 nm波长的太阳大气层。 HRI通道基于紧凑的两个反射镜离轴设计。光谱选择是通过沉积在反射镜上的多层涂层以及通过多余的铝滤光镜来拒绝可见光和红外光来实现的。该检测器是2k x 2k阵列背照式硅CMOS-APS,像素间距为10 µm,在EUV波长范围内敏感。由于仪器的紧凑性和光学设计的局限性,通道性能对制造非常敏感。 ,对齐方式和结算错误。因此,需要在两个光学布局之间进行权衡,以选择最终的光学设计并改善反射镜的安装。总的误差预算中已包括了由滤网支撑和镜面扩散引起的衍射效应。反射镜和安装座的生产已经开始,并将通过EUI仪器的结构和热模型(STM)进行热机械验证。由于通道入口孔径有限,因此输入通量较低,通道性能也取决于探测器EUV灵敏度,读出噪声和动态范围。基于CMOS-APS背面检测器原型的特性,并显示出令人鼓舞的结果,EUI检测器已被指定并正在开发中。这些检测器将在通过测试并集成到EUI仪器之前经过鉴定程序。

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